Smart surfaces
By embedding all electronics inside 3D injection molded plastics, IMSE® SiP enables a new level of electrical and mechanical integration and eliminates the need for external control electronics. Increasing the integration level and functionality does not mean increased system level complexity: IMSE® SiP simplifies wiring and significantly reduces the number of interfaces between the host system and the IMSE® part.
Standalone digital parts enable easy customization by software.
IMSE® SiP Overview:
With IMSE® SiP your IMSE® part becomes truly digital, adding functionality, efficiency, and higher integration all in one package.
By embedding all electronics inside 3D injection molded plastics, IMSE® SiP enables a new level of electrical and mechanical integration and eliminates the need for external control electronics. Increasing the integration level and functionality does not mean increased system level complexity: IMSE® SiP simplifies wiring and significantly reduces the number of interfaces between the host system and the IMSE® part.
Standalone digital parts enable easy customization by software.
IMSE® SiP Overview:
We want to remove the boundaries between technology and natural, human experiences – bringing intelligence to the surface
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