By embedding all electronics inside 3D injection molded plastics, IMSE® SiP enables a new level of electrical and mechanical integration and eliminates the need for external control electronics. Increasing the integration level and functionality does not mean increased system level complexity: IMSE® SiP simplifies wiring and significantly reduces the number of interfaces between the host system and the IMSE® part.
Standalone digital parts enable easy customization by software.
IMSE® SiP Overview:
With IMSE® SiP your IMSE® part becomes truly digital, adding functionality, efficiency, and higher integration all in one package.
By embedding all electronics inside 3D injection molded plastics, IMSE® SiP enables a new level of electrical and mechanical integration and eliminates the need for external control electronics. Increasing the integration level and functionality does not mean increased system level complexity: IMSE® SiP simplifies wiring and significantly reduces the number of interfaces between the host system and the IMSE® part.
Standalone digital parts enable easy customization by software.
IMSE® SiP Overview: