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IMSE® SiP - System In Package

IMSE® SiP - System In Package

By embedding all electronics inside 3D injection molded plastics, IMSE® SiP enables a new level of electrical and mechanical integration and eliminates the need for external control electronics. Increasing the integration level and functionality does not mean increased system level complexity: IMSE® SiP simplifies wiring and significantly reduces the number of interfaces between the host system and the IMSE® part.

Standalone digital parts enable easy customization by software.

IMSE® SiP Overview:

  • Designed specifically for in mold applications
  • Surface mount using standard high speed SMT equipment
  • IMSE specific landing pattern for electrical connections
  • 15mm by 15mm with 24 pads size to fit any design
  • Different sizes and denser pitch versions under development

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With IMSE® SiP your IMSE® part becomes truly digital, adding functionality, efficiency, and higher integration all in one package.

By embedding all electronics inside 3D injection molded plastics, IMSE® SiP enables a new level of electrical and mechanical integration and eliminates the need for external control electronics. Increasing the integration level and functionality does not mean increased system level complexity: IMSE® SiP simplifies wiring and significantly reduces the number of interfaces between the host system and the IMSE® part.

Standalone digital parts enable easy customization by software.

IMSE® SiP Overview:

  • Designed specifically for in mold applications
  • Surface mount using standard high speed SMT equipment
  • IMSE specific landing pattern for electrical connections
  • 15mm by 15mm with 24 pads size to fit any design
  • Different sizes and denser pitch versions under development
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