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Introducing the Mesa Controller with IMSE® SiP (System in Package)

Introducing the Mesa Controller with IMSE® SiP (System in Package)

The Mesa IMSE Controller presents an elegant, intuitive touch control interface. The Mesa design integrates sophisticated system electronics, IMSE SiP (system in package), inside the IMSE part. In Mesa, the IMSE SiP controls captivate touch functions and smart RGB LEDs providing functional and ambient illumination.

Mechanics design: Design and Simulation with Catia and related tools following TactoTek IMSE Designer rules.

IMSE Building Blocks

Touch Functions

  • Capactive sliders (sides)
  • Capactive button (top)

Illumination

  • Indicator lighting
  • Ambient lighting

Part Overview
  • Single-piece, seamless design
  • Wall thickness: 4.5 mm
  • Weight: 130 grams
  • In-mold electronics: IMSE SiP, circuitry, touch controls, lighting (smart RGB LEDs)
  • UART connector

Primary Production Processes

  • Screen printing and curing
  • Surface mounting electronics-high speed 2-dimensiona
  • High pressure thermoforming
  • Injection molding

Tooling Requirements

  • Injection molding (1)
  • A (top) firm forming (1)
  • B (bottom) film forming (1)
  • Film trimming (2)

Mechanics Design: Design and simulation with Catia and related tools following TactoTek IMSE Designer rules

Electronics Layout: In mold electronics engineered to TactoTek IMSE Designer rules using Altium Designer

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The Mesa IMSE Controller presents an elegant, intuitive touch control interface. The Mesa design integrates sophisticated system electronics, IMSE SiP (system in package), inside the IMSE part. In Mesa, the IMSE SiP controls captivate touch functions and smart RGB LEDs providing functional and ambient illumination.

Mechanics design: Design and Simulation with Catia and related tools following TactoTek IMSE Designer rules.

IMSE Building Blocks

Touch Functions

  • Capactive sliders (sides)
  • Capactive button (top)

Illumination

  • Indicator lighting
  • Ambient lighting

Part Overview
  • Single-piece, seamless design
  • Wall thickness: 4.5 mm
  • Weight: 130 grams
  • In-mold electronics: IMSE SiP, circuitry, touch controls, lighting (smart RGB LEDs)
  • UART connector

Primary Production Processes

  • Screen printing and curing
  • Surface mounting electronics-high speed 2-dimensiona
  • High pressure thermoforming
  • Injection molding

Tooling Requirements

  • Injection molding (1)
  • A (top) firm forming (1)
  • B (bottom) film forming (1)
  • Film trimming (2)

Mechanics Design: Design and simulation with Catia and related tools following TactoTek IMSE Designer rules

Electronics Layout: In mold electronics engineered to TactoTek IMSE Designer rules using Altium Designer
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