IMSE® solutions are made by integrating and encapsulating printed electronics and standard electronic components within durable 3D injection-molded plastics. Part of the technology development is to ensure that electric components and materials, such as polymer substrates, functional inks, and surface mounting adhesives, form a reliable solution. The technology verification includes stringent reliability testing. The used tests are rapid change of temperature, high temperature ageing and steady-state temperature-humidity.
This white paper and additional testing case was presented at the European Microelectronics Packaging Conference, Sept 13-16, 2021:
The presentation was held by Outi Rusanen, Principal Interconnection Specialist at TactoTek.