13.9.21
13.9.21
White papers

Reliable Smart Molded Structures

Reliable Smart Molded Structures

Reliable smart molded structures

IMSE® solutions are made by integrating and encapsulating printed electronics and standard electronic components within durable 3D injection-molded plastics. Part of the technology development is to ensure that electric components and materials, such as polymer substrates, functional inks, and surface mounting adhesives, form a reliable solution. The technology verification includes stringent reliability testing. The used tests are rapid change of temperature, high temperature ageing and steady-state temperature-humidity.

This white paper and additional testing case was presented at the European Microelectronics Packaging Conference, Sept 13-16, 2021:

  • IMSE technology verification test case: 3000 cycles of thermal cycling (-30 ℃ …. 80 ℃)
  • Thermal cycling did not change LED electrical or optical performance
  • Cross-section analysis of the thermally cycled LEDs showed that interconnections were intact
  • Overmolding strengthens IMSE structures and reduces plastic strain in the conductive adhesive during temperature cycling

The presentation was held by Outi Rusanen, Principal Interconnection Specialist at TactoTek.

Webinar Hosts

No items found.
No items found.
FOR MORE INFORMATION, PLEAsE CONTACT
No items found.

Download the white paper