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International Electrotechnical Commission (IEC) Publishes the First Standard on In-Mold Electronics

International Electrotechnical Commission (IEC) Publishes the First Standard on In-Mold Electronics
  • TactoTek’s leadership in IEC has enabled the publication of the world’s first standard for In-Mold Electronics  
  • The standard enables material suppliers – particularly functional ink suppliers – to characterize their inks according to accepted methods and procedures  
  • Standardized materials eliminate the risk of using non-verified materials and accelerate technology adoption

Oulu, Finland (14th September 2023) – The International Electrotechnical Commission (IEC)  has published the first standard “63899-202-10: Printed Electronics – Materials – Resistance measurement on thermoformable conducting” providing the printed electronics industry a standardized way to characterize the material. Finnish Structural Electronics pioneer TactoTek has led the standard development project that is part of Technical Committee (TC119) activities. First proposed by TactoTek, the development project initiated in 2019 has now resulted in this standard, which enables Injection Molded Structural Electronics (IMSE) designers to create optimized designs with standardized materials.

Standardized Characterization of Materials Enables IMSE®-Optimized Materials

Creating smart functional electronics with IMSE requires thermoforming, i.e. creating shapes from flat 2D functional films with printed circuitry and mounted components. Thermoforming elongates the printed layers, causing resistivity changes that should be considered during the design phase. Using a standardized measurement method ensures comparability of the results and leads to optimization of the designs/materials. The standard defines the terminology and measurement methods for characterizing the resistance change of conductive ink traces as a function of thermoplastic elongation and is applicable to thermoformable surfaces with conductive ink layers.

IEC and Other Leading Technical Bodies Enable the Adoption of New Technology

Accredited bodies like IEC creating standards enable confidence in new and innovative technologies. With over 170 nations, IEC has an expert pool to peer review technology and create standards.  According to Paavo Niskala, SVP of IMSE Technology at TactoTek, “TactoTek sees that standardization will speed up the industrialization of structural electronics technologies such as Injection Molded Structural Electronics (IMSE). Thus, TactoTek wants to disseminate some of its knowledge through standardization work. We see that IEC's way of working and input from other TC119 National Committees has been beneficial in developing the standard  and the structural electronics industry as a whole.”

About TactoTek®

TactoTek is the leading provider of Injection Molded Structural Electronics (IMSE®) solutions that integrate printed circuitry and electronic components into 3D injection molded smart surfaces. Leading IMSE use cases include human-machine interfaces (HMI), connectivity, and electronic styling features for automotive, smart homes, appliances, and other markets. IMSE outperforms conventional electronics manufacturing methods by reducing Greenhouse gas emissions significantly. Benefiting from simulated design processes and reduced material use, IMSE Designed smart surfaces are considerably lighter in mass, leading to substantial lifetime greenhouse gas reductions. TactoTek develops and industrializes IMSE technology, creates mass production-ready IMSE prototypes, and licenses IMSE technology for 3rd party IMSE part design and global mass production.

TactoTek is funded by international leaders in finance and industry committed to advancing technology solutions that benefit consumers and the environment. TactoTek investors include Conor Venture Partners, 3M Ventures, Repsol Energy Ventures, Faurecia Ventures, Voima Ventures, Tesi, Nidoco AB, and Cornes. For more information, please visit tactotek.com.

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Karthikesh Raju

SVP Product Management and Marketing


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