Injection Molded Structural Electronics
Light, thin, mass produced, 3D smart molded structures
New location delivers increased production capacity, purpose-built facility for all IMSE manufacturing processes, and room to grow OULU, FINLAND (11 July 2017) – Today, TactoTek announced the opening of its new manufacturing and corporate headquarters facilities in...read more
10 July 2017 - Field-leading IMSE products need field-leading development teams and facilities. Watch our video tour of our new home and see how we make innovation happen. Watch more videos on our Vimeo channel, and learn more about how we do things on the Technology...read more
Get to Know Our Facilities
TactoTek engineering team adapts customer designs into Injection Molded Structural Electronics solutions, and the vertically integrated production line optimizes them for mass production.
Include new functions, create innovative shapes and add electronic functionality in new locations when traditional design constraints are eliminated.
Our in-mold electronics have a typical wall thickness of 2-4mm, and do not require the depth of light pipes and full width PCBs.
TactoTek structures are molded using standard plastics and eliminate multiple structural elements found in typical electronics designs.
Technology & Manufacturing
TactoTek In-Mold Structural Electronics Manufacturing Process
Print decoration on in-mold labeling (IML) film
Print electronics on film: wiring, capacitive touch sensors and antennas
Surface mount electronic components on film
Thermoform film into 3D shape
Injection mold part using film insert
“Wearable Technology, the Internet of Things and other new applications of electronics cannot be adequately served by the 100 year old components-in-a-box approach.
Lightweight, shaped, rugged, structural construction, where TactoTek excels, is essential. It will be invaluable in electric vehicles for example.”
Dr Peter Harrop IDTechEx, author of the report
”Structural Electronics 2015-2025″
“We are pleased that TactoTek’s 3D design and manufacturing expertise, including integrating ICs, are helping to make in-mold electronics a reality.”
John Voultos, Global Business Development Leader
DuPont Advanced Materials (DuPont)