Injection Molded Structural Electronics

Light, thin, mass produced, 3D smart molded structures

Use Cases

Automotive

3D contoured electronics: thin, light, seamless. TactoTek innovations free Industrial Designers to reshape, restyle and reinvent vehicle electronics. Imagine the possibilities.

Home Appliances & Automation

Graceful curves, responsive touch and advanced connectivity in ultra-thin, highly integrated designs: Smart Molded Structures make elegant solutions.

Wearables

Flexible, comfortable, durable and mass producible: TactoTek molds in intelligence that powers wearable technology.

Benefits

Design freedom

Include new functions, create innovative shapes and add electronic functionality in new locations when traditional design constraints are eliminated.

Durability & protection

Encapsulating printed electronics and components within plastics seals systems from moisture and debris, and protects them from shock and vibration.

Space-saving technology

Our in-mold electronics have a typical wall thickness of 2-4mm, and do not require the depth of light pipes and full width PCBs.

Excellent touch performance

Deliver superior performance by locating touch sensors as close as 0.1mm from the user; systems can be designed for reliable use with leather gloves.

Light weight

TactoTek structures are molded using standard plastics and eliminate multiple structural elements found in typical electronics designs.

Simple assembly

TactoTek in-mold electronics integrate many electronic functions within cosmetic plastics which reduces the number of parts and simplifies assembly.

Want to learn more?

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Want to learn more?

Contact us

Technology & Manufacturing

TactoTek In-Mold Structural Electronics Manufacturing Process

1

Print decoration on in-mold labeling (IML) film

2

Print electronics on film: wiring, capacitive touch sensors and antennas

3

Surface mount electronic components on film

4

Thermoform film into 3D shape

5

Injection mold part using film insert

“We are witnessing a global transformation in electronics design as lightweight, shaped, rugged, structural electronics, where TactoTek excels, replace the 100-year-old components-in-a-box approach.”

Dr Peter Harrop, Chairman of IDTechEx & Author of the report
”Structural Electronics 2015-2025″

“We are pleased that TactoTek’s 3D design and manufacturing expertise, including integrating ICs, are helping to make in-mold electronics a reality.”

John Voultos, Global Business Development Leader
DuPont Advanced Materials (DuPont)

“We are very pleased to partner with TactoTek. Their innovative process perfectly fits in our “smart life on board” strategy to integrate breakthrough HMI technology solutions which will play a key role in the cockpit of the future and will create a new on-board connectivity experience.”

Eric de La Gironnière, President of Faurecia Ventures″

“TactoTek’s fluency in adapting traditional electronics designs into IMSE solutions, combined with their ability to quickly produce prototypes that are ready for mass production in their vertically-integrated factory sets them apart from all other companies.”

Kaz Oki, VP of New Product Planning at Nissha USA, Inc″

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