Smart molded structures

Electronics encapsulated within light, thin, mass produced 3D plastics Contact us

Smart molded structures

Electronics encapsulated within light, thin, mass produced 3D plastics Contact us

Use Cases


3D contoured electronics: thin, light, seamless. TactoTek innovations free Industrial Designers to reshape, restyle and reinvent vehicle electronics. Imagine the possibilities.

Home Appliances & Automation

Graceful curves, responsive touch and advanced connectivity in ultra-thin, highly integrated designs: Smart Molded Structures make elegant solutions.


Flexible, comfortable, durable and mass producible: TactoTek molds in intelligence that powers wearable technology.


Design freedom

Include new functions, create innovative shapes and add electronic functionality in new locations when traditional design constraints are eliminated.

Durability & protection

Encapsulating printed electronics and components within plastics seals systems from moisture and debris, and protects them from shock and vibration.

Space-saving technology

Our in-mold electronics have a typical wall thickness of 2-4mm, and do not require the depth of light pipes and full width PCBs.

Excellent touch performance

Deliver superior performance by locating touch sensors as close as 0.1mm from the user; systems can be designed for reliable use with leather gloves.

Light weight

TactoTek structures are molded using standard plastics and eliminate multiple structural elements found in typical electronics designs.

Simple assembly

TactoTek in-mold electronics integrate many electronic functions within cosmetic plastics which reduces the number of parts and simplifies assembly.

Want to learn more?

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Want to learn more?

Contact us

Technology & Manufacturing

TactoTek In-Mold Electronics Manufacturing Process


Print decoration on in-mold labeling (IML) film


Print electronics on film: wiring, capacitive touch sensors and antennas


Surface mount electronic components on film


Thermoform film into 3D shape


Injection mold part using film insert

“Wearable Technology, the Internet of Things and other new applications of electronics cannot be adequately served by the 100 year old components-in-a-box approach.
Lightweight, shaped, rugged, structural construction, where TactoTek excels, is essential. It will be invaluable in electric vehicles for example.”

Dr Peter Harrop IDTechEx, author of the report
”Structural Electronics 2015-2025″

“We are pleased that TactoTek’s 3D design and manufacturing expertise, including integrating ICs, are helping to make in-mold electronics a reality.”

John Voultos, Global Business Development Leader
DuPont Advanced Materials (DuPont)

Upcoming Events

K 2016 | 19-26 Oct 2016

Düsseldorf, Germany | 19-26 Oct 2016 Details: K Fair is regarded as the World’s No. I Trade Fair for Plastics and Rubber. Everything from the latest state of the art and trailblazing innovations to development visions. If you would like to arrange a meeting with...

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2016Flex Europe (Semicon Europa) | 25-26 Oct 2016

Grenoble, France | 25-26 Oct 2016 Details: 2016FLEX Europe - part of Semicon Europa conference - is focused on integrating silicon electronics onto flexible substrates. TactoTek CTO & Co-Founder Antti Keränen presenting: Injection Molded Electronics: Mass Manufactured...

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Electronica – Planet e | 8 – 11 Nov 2016

Munich, Germany | 8-11 Nov 2016 Details: Electronica is one of the world's leading trade fairs for electronic components, systems and applications. Whether it comes to PCBs, semiconductors, sensors, connectors or displays: electronica is a place to find out what...

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